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GM-1100

14/13/12 代 Intel® Core™ 系列嵌入式 GPU 电脑,支持 1x MXM 3.1 GPU 扩展插槽
产品特点
  • Intel® 14/13/12 代 Core™ i9/i7/i5/i3 处理器(最大 65 W TDP)
  • 支持 1x MXM 3.1 Type A/B 规格的 GPU 模块扩展。
  • 1x 2.5GbE LAN、1x 20Gbps USB3.2 Gen2 x2、Type C 连接器
  • 1x M.2 Key M 2280 型插槽,用于 PCIe Gen4x4 NVMe 存储
  • 1x M.2 Key E 2230 型插槽,用于无线 / Intel CNVi 模块扩展
  • 1x M.2 Key B 3052/3042 型插槽,用于 5G / 存储 / 扩展卡扩展
  • 2x M.2 Key B 2242 型插槽,用于存储 / 扩展卡扩展
  • 选配 CMI & CFM 模块,用于 I/O 扩展及电源点火感应功能
  • 宽广操作温度范围 -40°C 至 70°C
产品认证
  • EN 50121-3-2
  • MIL-STD-810H
产品介绍
GM-1100

GM-1100 是一款可搭载 MXM GPU 的强固型嵌入式工控机,专为高效能运算需求所打造。除了具备强大的运算与图形处理能力外,紧凑的体积与高弹性的扩展能力,特别适合安装空间受限的边缘 AI 应用。


 

3X 效能大提升

——

搭载第 14 代 Intel® Raptor Lake-S Refresh Core 处理器,运算效能较前代机种提升三倍。无论是高复杂型或是专精型任务,可根据需求选择 Hybrid 或 P-core Monolithic 架构,展现出色效能。

3X 效能大提升

MXM GPU 模块
 

MXM GPU 模块

——

支持 Type A 和 Type B 的 MXM GPU 模块,无论是轻量 AI 应用或是需要高效能 AI 推理应用,都能自由选择。此外,GM-1100 的模块化设计,能轻松进阶更高的 MXM 模块,实现未来效能的无缝升级。

MXM GPU module icon

 

高速传输与 数据储存

——

为了有效提高影像或档案的传输效率,GM-1100 拥有原生 2.5GbE LAN 以及 20Gbps USB 3.2 Gen2x2 Type-C 高速 I/O 接口。储存选择除了 2x 2.5" HDD/SSD 外,也提供 NVMe SSD 的高速储存选项。

 

高速传输与数据储存


移动型应用的理想选择
 

移动型应用的 理想选择

——

除了紧凑的尺寸 (260 x 200 x 85 mm) 及丰富的 M.2 扩展槽可支持 5G 或 Wi-Fi 等无线通信模块外,GM-1100 还符合轨道交通认证 (EN50121-3-2) 和车载认证 (E-mark),是移动型应用的不错选择。

mobile applications icon

 

出色的 散热解决方案

——

GM-1100 的散热规划,能有效将 CPU 和 GPU 的热能分别引导至铝挤外壳的上盖与侧边,提高散热效率。同时结合外部风扇,为稳定且可靠的运行提供坚实基础。

出色的散热解决方案

强固安全
 

强固 安全

——

为克服 Edge AI 安装环境的严苛挑战,除工业级的防护如支持 -40 至 70°C宽温范围与 9 - 48 VDC 宽压外,还通过美国军规冲击震动标准(MIL-STD-810H),确保产品的稳定安全性。

Rugged safety icon

视频
详细规格
Model NameGM-1100
SystemProcessor

14th Generation Intel® Raptor Lake-S Refresh Series CPU (Coming Soon)
13th Generation Intel® Raptor Lake-S Series CPU:
• Intel® Core™ i9-13900E 24 Cores Up to 5.2 Ghz, TDP 65W
• Intel® Core™ i7-13700E 16 Cores Up to 5.1 Ghz, TDP 65W
• Intel® Core™ i5-13500E 14 Cores Up to 4.6 Ghz, TDP 65W
• Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
• Intel® Core™ i3-13100E 4 Cores Up to 4.4 Ghz, TDP 65W
• Intel® Core™ i9-13900TE 24 Cores Up to 5.0 Ghz, TDP 35W
• Intel® Core™ i7-13700TE 16 Cores Up to 4.8 Ghz, TDP 35W
• Intel® Core™ i5-13500TE 14 Cores Up to 4.5 Ghz, TDP 35W
• Intel® Core™ i3-13100TE 4 Cores Up to 4.1 Ghz, TDP 35W
12th Generation Intel® Alder Lake-S Series CPU:
• Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W
• Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
• Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
• Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
• Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
• Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
• Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
• Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
• Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
• Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
• Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
• Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W

Chipset• Intel R680E Chipset
Memory• 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB
BIOS• AMI BIOS
GraphicsGraphics Engine• Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
• Integrated Intel® UHD Graphics 730: Core™ i3
• Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
Maximum Display Output• Supports Triple Independent Display 
DP• 1x DisplayPort Connector (4096 x 2304@60Hz)
  *Verified maximum resolution: 3840x2160@ 60Hz
HDMI• 1x HDMI Connector (4096 x 2160@30Hz)
  *Verified maximum resolution: 3840x2160@ 30Hz
VGA• 1x VGA Connector (1920 x 1200 @60Hz)
AudioAudio Codec• Realtek® ALC888, High Definition Audio
Line-out• 1x Line-out, Phone Jack 3.5mm
Mic-in• 1x Mic-in, Phone Jack 3.5mm
I/OLAN• 1x 2.5GbE LAN, RJ45
  -  Intel® I225
• 1x 1GbE LAN, RJ45
  -  Intel® I219
COM• 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
USB• 1x 20Gbps USB3.2 Gen2 x2, Type C
• 3x 10Gbps USB3.2 Gen2 x1, Type A
• 4x 5Gbps USB3.2 Gen1 x1, Type A
StorageSSD/HDD• 2x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 )
  (up to 15mm in Height)
M.2 SSD• 1x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0)
• 1x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3x2 NVMe SSD or SATA SSD (SATA3.0)
• 2x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4x2 NVMe SSD or SATA SSD (SATA3.0)
RAID• Support RAID 0/1/5/10
ExpansionMXM Socket• 1x MXM Carrier Board Socket for MXM GPU Module Expansion
M.2 E Key Socket• 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion
M.2 B Key Socket• 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion
• 2x M.2 Key B Type 2242 Socket (PCIe Gen 4x2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion
SIM Socket• 2x SIM Socket
CMI (Combined Multiple I/O) Interface• 1x High Speed CMI Interface for optional CMI Module Expansion
• 1x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface• 1x CFM IGN Interface for optional CFM-IGN Module Expansion
Other FunctionExternal FAN Connector• 2x External FAN Connector, 4-pin Terminal Block
  (Support Smart Fan by BIOS)
Power Ignition Sensing• Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V
  (With Optional CFM Module)
Clear CMOS Switch• 1x Clear CMOS Switch
Reset Button• 1x Reset Button
Instant Reboot• Support 0.2sec Instant Reboot Technology
Watchdog Timer• Software Programmable Supports 256 Levels System Reset
Antenna Holes• 2x Antenna Holes
Status LED Indicator• HDD LED、GPIO LED、IGN LED、GPU LED、Ethernet LED
PowerPower Button• 1x ATX Power On/Off Button
Power Mode Switch• 1x AT/ATX Mode Switch
Power Input• 9-48 VDC, Single Power Source
  Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A
• Power input voltage from 9V to 23V must use dual power connectors,
  power input voltage from 24V to 48V can use single power connector
Remote Power On/Off• 1x Remote Power On/Off, 2-pin Terminal Block
Max. Power Consumption• 35W CPU: 187.51W
• 65W CPU: 258.96W
  - Test conducted with CPU, 1x RAM, and 1x storage
  - 100% load during burn-in testing.
PhysicalDimension ( W x D x H )• 260 x 200 x 85 mm
Weight Information• 4.73 kg
Mechanical Construction• Extruded Aluminum with Heavy Duty Metal
Mounting• Wall / Side / DIN-RAIL / VESA Mount
Physical Design• Fanless Design
• Cableless Design
• Jumper-less Design
• Unibody Design
Reliability & ProtectionReverse Power Input Protection• Yes
Over Voltage Protection• Protection Range: 51~58V
• Protection Type: shut down operating voltage, re-power on at the preset level to recover
Over Current Protection• 30A
CMOS Battery Backup• SuperCap Integrated for CMOS Battery Maintenance-free Operation
MTBF• 313,541 Hours
  -  Database: Telcordia SR-332 Issue3, Method 1, Case 3
Operating SystemWindows• Windows®11, Windows®10
Linux• Ubuntu Desktop 22.04 LTS
EnvironmentOperating Temperature• 35W TDP Processor: -40°C to 70°C
• 65W TDP Processor with external FAN: (TBC) 
  * PassMark BurnInTest: 100% CPU, 2D/3D Graphics   (without thermal throttling) 
  * For GM-1100 + MXM GPU Module operating temperature, please refer to the last page – Operating Temperature Matrix Table for more information (TBC) 
  * With extended temperature peripherals; Ambient with air flow 
  * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature• -40°C to 70°C
Relative Humidity• 95%RH @ 70°C (non-Condensing)
Shock• MIL-STD-810H
Vibration• MIL-STD-810H
EMC• CE, UKCA, FCC, ICES-003 Class A
• EN 50155 (EN 50121-3-2 Only)
• E-mark (Pending)
EMI• CISPR 32 Conducted & Radiated: Class A
• EN/BS EN 50121-3-2 Conducted & Radiated: Class A
• EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
• EN/BS EN 61000-3-3 Voltage fluctuations & flicker
• FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
EMS• EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
• EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
• EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
• EN/IEC 61000-4-5 Surges: AC Power: 2 kV
• EN/IEC 61000-4-6 CS: 10V 
  (**Compliant with the standard when utilizing shielded cable.)
• EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
• EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
订购信息
Available Model
Model No.Description
GM-1100-R1014/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket
 
Package Checklist
GM-1100 GPU Computer x 1Remote Function Terminal Block Connector x1
CPU Heatsink Pack x1External Fan Terminal Block Connector x2
Screw Pack x1Wall Mounting Kit x1 
Power Terminal Block Connector x 2M.2 Key B Type 3052 to 3042 Adapter Bracket x1
 
Optional MXM GPU Module & Accessories
Model No.Description
MXM-A4500-R10NVIDIA Embedded RTX A4500 MXM Type A, 16G, 80W Kit with Heatsink and Thermal Pad
MXM-A2000-R10NVIDIA Embedded RTX A2000 MXM Type A, 8G, 60W Kit with Heatsink and Thermal Pad
MXM-A1000-R10NVIDIA Embedded RTX A1000 MXM Type A, 4G, 60W Kit with Heatsink and Thermal Pad
MXM-A500-R10NVIDIA Embedded RTX A500 MXM Type A, 4G, 40W Kit with Heatsink and Thermal Pad
MXM-RTX3000-R10NVIDIA Quadro Embedded RTX3000 MXM Kit with Heatsink and Thermal Pad
MXM-T1000-R10NVIDIA Quadro Embedded T1000 MXM Kit with Heatsink and Thermal Pad
MXM-HSKA-01MXM Type A Heatsink Kit for MXM-A500
MXM-HSKA-02MXM Type A Heatsink Kit for MXM-A1000 & MXM-A2000
MXM-HSKA-03MXM Type A Heatsink Kit for MXM-T1000
MXM-HSKB-01MXM Type B Heatsink Kit for MXM-A4500
MXM-HSKB-02MXM Type B Heatsink Kit for MXM-RTX3000
 
Optional Modules and Accessories
Model No.Description
CB-DP02-R10Carrier Board with one MXM 3.1 interface and no DisplayPort output for MXM-A500
CB-DP03-R10Carrier Board with 1x MXM 3.1 Interface and 4x DisplayPort Output
CB-DP04-R10Carrier Board with 1x MXM 3.1 Interface and 4x DisplayPort Output for MXM-A4500
CMI-LAN01-R12CMI Module with  4x RJ45 Intel I210 GbE LAN Ports
CMI-M12LAN01-R12CMI Module with M12 A-Coded Connector, 4x Intel I210 GbE LAN Ports
CMI-XM12LAN01-R10CMI Module with M12 X-Coded Connector, 4x Intel I210 GbE LAN Ports
CMI-10GLAN01-R10CMI Module with 2x Intel® X550 10GbE LAN, RJ45 Port 
CMI-DIO01CMI Module with 16x Optical Isolated DIO (8 in/8 out)
CMI-COM01CMI Module with 2x RS232/422/485 (Support 5V/12V) 
CFM-PoE01CFM Module with PoE Control Function, Individual Port 25.5W
CFM-IGN01CFM Module with Power Ignition Sensing Control Function, 12V/24V Voltage Detection Selectable
UB1303Universal Bracket with 2x DB9 Cutout
UB1310Universal Bracket with 4x M12 Cutout
UB1312Universal Bracket with 4x RJ45 Cutout
UB1318Universal Bracket with DIO Cutout
UB1320-R10Universal Bracket with 3x Antenna Cutout
UB1328Universal Bracket with 2x RJ45 Cutout
UB1329Universal Bracket with 4x DP
UB1330-R10Universal Bracket with 4x M12 X-Coded Cutout
FAN-EX102External Fan Kit with 2x 4pin Terminal Block Plug for GM Series, Support Smart Fan Function
SIDE-GMGM Series side mount kit
DIN01DIN-RAIL Mount Kit, KMRH-K175
GST220A24-CINAdapter AC/DC 24V 9.2A 220W with 3pin Terminal Block Plug 5.0mm Pitch, with TUBES, level VI
GST360A24-CINAdapter AC/DC 24V 15A 360W with 3pin Terminal Block Plug 5.0mm Pitch, with TUBES, level VI
 
Carrier Board and MXM GPU Compatibility Matrix
 CB-DP02 (compatible with standard UB)CB-DP03/UB1329CB-DP04/UB1329
MXM-A500V  
MXM-A1000 V 
MXM-A2000 V 
MXM-A4500  V
MXM-T1000 V 
MXM-RTX3000 V 
 
相关下载
Datasheet
文件名发行日期下载
GM-1100 Datasheet2024/11/18下载
Manual
文件名发行日期下载
GM-1100 User Manual2024/10/31
Driver
文件名发行日期下载
GM-1100 Driver - Audio2024/10/24下载
GM-1100 Driver - Chipset2024/10/24下载
GM-1100 Driver - COM2024/10/24下载
GM-1100 Driver - GNA2024/10/24下载
GM-1100 Driver - Graphics2024/10/24下载
GM-1100 Driver - LAN2024/10/24下载
GM-1100 Driver - ME2024/10/24下载
GM-1100 Driver - RST2024/10/24下载
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